| ‘? I G|750, GI751, G|752, GI754, G|756, G|7587 Www'V'Shay'C°m Vishay General Semiconductor THERMAL cHARAcTERls cs (TA = 25 00 unless otherwise noted) N ateU) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5 mm) lead length, PCB mounted with 1.1 “ x 1.1 "(30 mm X 30 mm) Copper pads ORDER NC INFORMAT on (Example) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODEI 13“ diameter paper tape and reel1 Ammo packpackaging RATINGS AND CHARACTERISTICS CuRvEs (TA = 25 (‘C unless otherwise noted) 5.0 1000 60 Hz Resistive7'0 or inductive Load 60 5.0 4.0 3.0 2.0 VRRM may be Applied BetweenEach Cycle o1Surge.It1e TJNoted ls TJ Prior to Surge Peak Fonlvard surge Current (A) é 1.1“xl.l“(3UmmX3Umm)‘>0 Copper Fads Average FonNard Rectilied Current (A) 0 100 20 40 60 E0 100 120 140 160 150 200 Ambient Temperature (Dc) Number of Cycles at 60 HZ Fig. 1 — Maximum Forward Current Derating Curve Fig. 3 — Maximum Peak FonNard Surge Current 100 Pulse Width 7 300 us1 % Duty Cycle 3 on Average FonNard Current (A) instantaneous Forward Current (A) 0.010 20 40 50 so 100 120 140 160 180 200 05 0.5 1.0 1.2 14 16 15 Lead Temperature (°C) Instantaneous Fonrvard Voltage (\I) Fig. 2 - Maximum Forward Current Derating Curve Fig. 4 - Typical Instantaneous Forward Characteristics Revision: 01-Aug-13 2 Document Number: 88627 For technical questions within your region: DiodesArnericas@vishay.corn, DiodesAsia@vishay.com, DiQdesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 |